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Peltier Condensation Prevention
Article by Jason on 09.09.2003
Conventional Methods:
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Initially I used a closed cell foam barrier to protect my peltier and cold
plate from condensation, as you can see to the right. This setup was
effective but there were problems inherent to using any kind of material
around the socket to insulate the peltier and cold plate against condensation.
Any foam or material around the CPU has the tendency initially to get
in the way of the CPU, cold plate, peltier, and water block assembly.
The risk of having an improperly mated cold plate and CPU can quickly
burn out an AMD based processor and even an Intel processor. There is
no way to be sure you are getting 100% full contact of all surfaces
if you utilize foam or any other material as an insulator. Of course
the hardcore overclocker knows that 100% full flat contact will lead
to the lowest temperatures and allow for the greatest overclocking.
Even assembling the surfaces ahead of time still allows for the potential
of foam or insulation to be pushed between your plates while putting
it into place.
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| As you can see an improper or slightly askew
installation of foam can leave a gap where air can enter and form condensation.
So your application of foam must both conform to the shape of your waterblock/peltier
assembly and it also must not get in the way of the mating surfaces or
it could cause poor temperatures or CPU burnout. |
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| Ideally we would all like to see a situation
similar to the picture shown. A waterblock/peltier assembly with no foam
or surrounding insulation. We can be sure of 100% contact of the surfaces
and we can no see clearly everything while it is working. Unfortunately
if we were to connect the tubes for the water system and turn this system
on as it is the condensation would form almost instantly and a short would
occur within seconds. |
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** Discuss this article with Jason and other readers in our forums! **
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