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Kingmax TinyBGA DDR400 PC3200 Revised Edition

Review by Edward Chang

March 25, 2002

TinyBGA TECHNOLOGY:

TinyBGA is a unique DRAM packaging size used in conjunction with advanced DRAM module technology that allows for greater memory capacity for the fast-growing market of compact and miniature products.

BENEFITS:

Higher Memory Capacity

With TinyBGA, the amount of memory per square inch ration increases dramatically. Within the same footprint of a 128MB TSOP-based, 144-pin SO-DIMM PCB, Kingmax makes 256MB capacity a reality.

Package	Length (mm)	Width (mm)	Area (mm^2)
TinyBGA	9	12	108
TSOP	11.8	22.3	263

Higher Maximum Frequency

TinyBGA chips can withstand frequency as high as 300 MHz, compared to TSOP's 150 MHz maximum frequency.

Package	Resistance Range	Inductance Range	Capacitance Range	Frequency Range
TinyBGA	0.3~15 mohm	0.8~1.8 nH	0.0~0.1 pF	250 MHz and up
TSOP	10~30 mohm	1.3~6.0 nH	0.3~0.7 pF	up to 150 MHz

Higher Electrical Performance

Less noise and cross-talk.

Higher Thermal Disspation

Repeated simulation tests show that TinyBGA's thermal resistance is only 75% of TSOP's thermal resistance. Clearly, TinyBGA is more responsive and has a faster heat dissapation rate when compared with TSOP. Please refer to the table for more details.

Package	Chip Size	Package Size	Theta ja	Max Chip Surface Temp.	Max EMC Surface Temp.
TinyBGA	10.39 x 5.3 mm	12 x 9 mm	23.92	93.9 C	93. C
TSOP	1039 x 5.3 mm	22.3 x 11.8 mm	32.358	102.2 C	101.8 C

Low Cost

TinyBGA package technique can reduce packaging costs lower than that of TSOP when the design rule heads toward the sub-0.25 micrometer directron.

Character	TinyBGA	TSOP (Industrial Standard)
Frequency	O	X
Size	O	X
Heat Dissipation	O	X
Power Consumption	O	X
Cost	O	X
Reliability	O	X

With TinyBGA, Kingmax once again sets the new ground in term of memory module manufuacturing. TinyBGA allows Kingmax to manufacture top-notched and high-quality memory module, while lowering the manufacuring cost, and to offer higher capacity that has been impossible to achieve with TSOP packaging technique.

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