VIA Launches First Single-Chip Embedded Chipset, the CX700
 

Fremont, California, 4th April 2006 - VIA Technologies, Inc, a leading innovator and developer of silicon chip technologies and PC platform solutions, today announced the VIA CX700 digital media IGP chipset for the VIA C7® and Eden® processor platforms, the most advanced x86 embedded chipset that integrates all the cutting-edge features of a modern chipset's North and South bridges, including rich video graphics, HD audio, and DDR2 and SATA II support, into a single, compact and highly power-efficient package.

Designed specifically for the embedded market and already adopted by leading industry players, the VIA CX700 will be on display at the VIA booth #1145 and partners' booths at the Embedded Systems Conference show in San Jose, California
this week.

Noted for their low power consumption, low heat output designs this is excellent news for the embedded chip industry.

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