|
In this section we discuss the most critical factor of performance. We assembled and tested the 3D Galaxy Liquid Cooling System under two different platforms. First we tested it for use with a socket 939 system powered by a 4800+ dual core and then in a socket 775 system with a P4 3.2 GHz CPU. In both platforms 100% load was achieved by running two instances of Prime 95 and setting the CPU affinity of each instance with both core 0 and core 1 simultaneously. Test System Configuration: AMD 4800+ P4 640 3.2GHz For comparative purposes we feel it’s applicable to include the recorded temperatures when the stock heatsink is used. These are idle temperatures when the ambient room temperature was 76F. Cool N’ Quiet was enabled on the AMD test setup. Stock Air Cooled Heatsink Results
Galaxy 3D LCS
As you can see the Galaxy 3D LCS works well and drops the AMD and Intel stock
temperatures by 12F and 15F respectively compared to stock cooling. Additional
benefits from the drop in temperature include lower noise levels, even at a
fan speed setting of high. At a low fan speed the fan is barely detectable and
is still providing 6 to 11 degrees better than stock cooling temperatures.
|
|
:: Copyright © 2002-2008 Techware Labs, LLC :: All Rights Reserved |