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Thermal Paste Comparison
Reviewed by Jason Jacobs on 08.13.2003


The Test Setup:

Abit KX7-333R

Bios B6

AMD XP 2200+ A core

512 Geil PC3200

WD 800JB

Windows XP SP1

Each of the thermal materials was tested under three different settings: first under the normal use of a heat sink, second with a water system, and third with the use of a peltier/water system.

Temperature measurements were taken using a Craftsman Autoranging Multimeter 82022 with a temperature probe placed on the die.

Heat Sink: ThermalTake Volcano 7

Ambient Temp: 26.6C or 80F

The thermal compounds were left on for a period of 3 days and recordings taken of the temperatures during idle and load. In all cases, load temperatures were measured after running Prime 95 for extended periods.

Product: Idle Day 1 Load Day 1 Idle Day 2 Load Day 2 Idle Day 3 Load Day 3
Nanotherm Blue II 42C 46C 42C 46C 41C 46C
Nanotherm Silver XTC 40C 45C 41C 46C 41.5C 45C
Nanotherm PCM+ 40C 46C 41.5C 44.5C 40C 44C
Arctic Silver 3 41C 45C 41C 45C 40.5C 44.5C
Silver Grease 45C 55C 45C 54C 45C 54C
Shin Etsu G751 41C 45C 40.5C 44.5C 39.5C 43C
Silicone Compound 47C 60C 47C 60C 47C 60C

As expected, several of the thermal pastes are very close in their performance. The overall best performance is given when the G751 is used. The PCM+ and AS3 are nearly tied at the end of 3 days, and are both excellent choices for a thermal compound.


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