Kingmax TinyBGA DDR400 PC3200 Revised Edition
Review by Edward Chang
March 25, 2002
TinyBGA TECHNOLOGY:
TinyBGA is a unique DRAM packaging size used in conjunction with advanced DRAM module technology that allows for greater memory capacity for the fast-growing market of compact and miniature products.
BENEFITS:
Higher Memory Capacity
With TinyBGA, the amount of memory per square inch ration increases dramatically. Within the same footprint of a 128MB TSOP-based, 144-pin SO-DIMM PCB, Kingmax makes 256MB capacity a reality.
| Package | Length (mm) | Width (mm) | Area (mm^2) |
| TinyBGA | 9 | 12 | 108 |
| TSOP | 11.8 | 22.3 | 263 |
Higher Maximum Frequency
TinyBGA chips can withstand frequency as high as 300 MHz, compared to TSOP's 150 MHz maximum frequency.
| Package | Resistance Range | Inductance Range | Capacitance Range | Frequency Range |
| TinyBGA | 0.3~15 mohm | 0.8~1.8 nH | 0.0~0.1 pF | 250 MHz and up |
| TSOP | 10~30 mohm | 1.3~6.0 nH | 0.3~0.7 pF | up to 150 MHz |
Higher Electrical Performance
Less noise and cross-talk.
Higher Thermal Disspation
Repeated simulation tests show that TinyBGA's thermal resistance is only 75% of TSOP's thermal resistance. Clearly, TinyBGA is more responsive and has a faster heat dissapation rate when compared with TSOP. Please refer to the table for more details.
| Package | Chip Size | Package Size | Theta ja | Max Chip Surface Temp. | Max EMC Surface Temp. |
| TinyBGA | 10.39 x 5.3 mm | 12 x 9 mm | 23.92 | 93.9 C | 93. C |
| TSOP | 1039 x 5.3 mm | 22.3 x 11.8 mm | 32.358 | 102.2 C | 101.8 C |
Low Cost
TinyBGA package technique can reduce packaging costs lower than that of TSOP when the design rule heads toward the sub-0.25 micrometer directron.
| Character | TinyBGA | TSOP (Industrial Standard) |
| Frequency | O | X |
| Size | O | X |
| Heat Dissipation | O | X |
| Power Consumption | O | X |
| Cost | O | X |
| Reliability | O | X |
With TinyBGA, Kingmax once again sets the new ground in term of memory module manufuacturing. TinyBGA allows Kingmax to manufacture top-notched and high-quality memory module, while lowering the manufacuring cost, and to offer higher capacity that has been impossible to achieve with TSOP packaging technique.
| « Page 3 | Page 5 » |