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Thermal Paste Comparison
Reviewed by Jason Jacobs on 08.13.2003
Information about the contenders:
| Silicone Paste: A generic compound applied to many heatsinks, including most graphic processors and northbridge chipsets. |
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Arctic Silver 3: Made by Arctic Silver, it is a thermal compound engineered specifically for use on computer components. It is composed of 99.9% micronized silver, and claims the following specifications:
Thermal conductivity: >9.0 W/mK (Hot Wire Method Per MIL-C-47113)
Thermal Resistance: <0.004°C-in²/Watt (0.001 inch layer)
Extended temperature limits: – 40°C to >180°C
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Nanotherm Blue II: Made by Nanotherm as a thermal material, it claims the following:
Nanotherm Blue II is a unique nanocomposite multiceramic thermal interface compounds that contain a special blend of engineered materials, including Boron Nitride, Aluminum Oxide, Aluminum Nitride and other nanopowders, compounded into a proprietary multisynthetic carrier fluid comprised of USDA authorized "food grade" lubricants. |
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Nanotherm Silver XTC: Manufactured by Nanotherm as a silver thermal compound. It claims the following:
This "Xtreme Thermal Compound" contains a one of the highest loadings of Silver particles of any compound on the market. We use a special mixture of custom-milled Silver particles (99.98% pure) which are blended into a unique high temperature synthetic suspension fluid. The Nanotherm Silver XTC also contains a small percentage of the special Boron Nitride and "Nano" powders used in our Nanotherm II thermal compounds to further enhance the performance of the compound. The Nanotherm Silver XTC comes in a measured, clear 3 ml syringes each packed with a hefty 4.0 g / 1.15 ml of compound |
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Nanotherm PCM+: Also manufactured by Nanotherm as a thermal compound, it claims the following:
The Nanotherm PCM+ is a unique, new thermally conductive Phase Change Material designed to provide superior heat transfer and cooling characteristics (for air and water cooled computer, electronic and general thermal management applications) over other thermal interface materials, such as thermal greases, thermal pads and other PCMs. |
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| Shin Etsu G751: A particularly rare thermal compound in the United States, which is manufactured in Japan by a company called MicroSi [Shin Etsu Chemical]. Documents concerning the actual composition and thermal conductivity are not available at this time. |
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Silver Grease: Widely available through several different companies and sold as a silver compound. Its composition and thermal claims are as follows:
Contains 10% silver oxide.
Conductivity: >7.5W/m-k Thermal
Resistance: >0.06 C -in2/W
Net Weight: 1.5grams
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