Thermal Paste Comparison
Reviewed by Jason Jacobs on 08.13.2003
The Test Setup:
Abit KX7-333R
Bios B6
AMD XP 2200+ A core
512 Geil PC3200
WD 800JB
Windows XP SP1
Each of the thermal materials was tested under three different settings: first under the normal use of a heat sink, second with a water system, and third with the use of a peltier/water system.
Temperature measurements were taken using a Craftsman Autoranging Multimeter 82022 with a temperature probe placed on the die.
Heat Sink: ThermalTake Volcano 7
Ambient Temp: 26.6C or 80F
The thermal compounds were left on for a period of 3 days and recordings taken of the temperatures during idle and load. In all cases, load temperatures were measured after running Prime 95 for extended periods.
| Product: | Idle Day 1 | Load Day 1 | Idle Day 2 | Load Day 2 | Idle Day 3 | Load Day 3 |
| Nanotherm Blue II | 42C | 46C | 42C | 46C | 41C | 46C |
| Nanotherm Silver XTC | 40C | 45C | 41C | 46C | 41.5C | 45C |
| Nanotherm PCM+ | 40C | 46C | 41.5C | 44.5C | 40C | 44C |
| Arctic Silver 3 | 41C | 45C | 41C | 45C | 40.5C | 44.5C |
| Silver Grease | 45C | 55C | 45C | 54C | 45C | 54C |
| Shin Etsu G751 | 41C | 45C | 40.5C | 44.5C | 39.5C | 43C |
| Silicone Compound | 47C | 60C | 47C | 60C | 47C | 60C |
As expected, several of the thermal pastes are very close in their performance. The overall best performance is given when the G751 is used. The PCM+ and AS3 are nearly tied at the end of 3 days, and are both excellent choices for a thermal compound.
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