Thermal Paste Comparison
Reviewed by Jason Jacobs on 08.13.2003

The Test Setup:

Abit KX7-333R

Bios B6

AMD XP 2200+ A core

512 Geil PC3200

WD 800JB

Windows XP SP1

Each of the thermal materials was tested under three different settings: first under the normal use of a heat sink, second with a water system, and third with the use of a peltier/water system.

Temperature measurements were taken using a Craftsman Autoranging Multimeter 82022 with a temperature probe placed on the die.

Heat Sink: ThermalTake Volcano 7

Ambient Temp: 26.6C or 80F

The thermal compounds were left on for a period of 3 days and recordings taken of the temperatures during idle and load. In all cases, load temperatures were measured after running Prime 95 for extended periods.

As expected, several of the thermal pastes are very close in their performance. The overall best performance is given when the G751 is used. The PCM+ and AS3 are nearly tied at the end of 3 days, and are both excellent choices for a thermal compound.

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