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CoolIT Systems Debuts Micro Data Center, High TDP Processor Coldplates and New Liquid Cooled OEM Servers at ISC High Performance 2017

CoolIT Systems Debuts Micro Data Center, High TDP Processor Coldplates and New Liquid Cooled OEM Servers at ISC High Performance 2017

Booth #C-1210 features industry leading range of Direct Contact Liquid Cooling technology

Frankfurt, Germany. June 19, 2017CoolIT Systems, Inc. (CoolIT), global leader in efficient liquid cooling technologies for HPC, Cloud and Enterprise markets, is returning to the International Supercomputing Conference – High Performance (ISC17) in Frankfurt as a Bronze Sponsor and Exhibitor for the sixth consecutive year.

ISC17 will feature a large range of HPC vendors, universities and research organizations gathering from around the world during June 19 – 21, 2017. CoolIT will be showcasing a range of new liquid cooling innovations including new server solutions for Dell EMC and Hewlett Packard Enterprise plus a full range of liquid cooling infrastructure products.

Vendor displays will include CoolIT’s OEM Blind-mate Blade Server Solution featuring 100% dry-break Stäubli quick disconnects. Blind-mate solutions feature easy operation for a reliable liquid connection and disconnection of servers from their chassis.

Chip-to-Atmosphere™ data center cooling will be featured in partnership with STULZ. Demonstrated within a Micro Data Center, the unified solution effectively manages heat loads from the processor level with liquid cooling through to the outside atmosphere.

Dell EMC and HPE and other servers will be features in the CoolIT booth including:

  • Debuting at ISC17 is the Dell EMC 14th Generation PowerEdge Server, liquid cooled by CoolIT Systems. Purpose-built for high performance, hyperscale workloads, this robust server allows customers to accelerate the delivery of business insights while reducing power costs and dramatically increasing rack density.
  • Hewlett Packard Enterprise Apollo 2000 System optimized with Rack DCLC™ and Closed-Loop DCLC™.
  • Huawei CH121 server which features CPU, Voltage Regulator and Memory cooling.

In partnership with STULZ, CoolIT will host an ISC17 Exhibitor Forum presentation on high-density Chip-to-Atmosphere™ data center cooling solutions on Tuesday June 20th at 4:40PM. CoolIT encourages all attendees to join the From Chip to Atmosphere – The Future of Data Center Cooling presentation at booth #M-210. During the session, Joerg Desler, President of STULZ Air Technology Systems, Inc. and Geoff Lyon, CEO and CTO at CoolIT Systems, will be educating visitors on how to put heat to use, with main discussion revolving around the efficiency gains and performance enhancements of HPC made possible by liquid cooling solutions.

In response to recent chip advancements, liquid cooling solutions for the latest high TDP processors will be revealed. These include CoolIT’s RX1 passive coldplate specifically designed for Intel® Xeon® Processor Scalable Family, and GP1 passive coldplate for NVIDIA Tesla P100.

CoolIT’s complete range of liquid-to-liquid heat exchangers will be on display, including the stand-alone CHx650, and the CHx80 for customers to review. Accompanying these will be CoolIT’s next generation liquid-to-air CDU, code-named ‘AHx Panorama’, a 5u AHx capable of managing 7-10kW per rack without facility water.

CoolIT will be featuring a case study for the exceptionally green data center cooling solution at the Poznan Supercomputing & Networking Center (PSNC). The PSNC “Eagle” cluster uses 1,232 liquid cooled Huawei CH121 servers to increase density and reduce energy consumption. PSNC was able to deploy this new cluster within their existing data center without having to invest in additional air cooling infrastructure. The heated liquid is also being reused for local heating needs. 

In partnership with Boston and NVIDIA, CoolIT is also proud to support The University of Edinburgh EPCC team in the ISC17 Student Cluster Competition with a liquid cooled solution for their cluster configuration.

To learn more about how CoolIT’s products and solutions maximize data center performance and efficiency whilst significantly reducing OPEX and overall TCO, visit ISC17 booth C-1210. Executives and technical staff will be on site to guide attendees through new product showcases, live demos and customer case studies to aid in showcasing the benefits of liquid cooling in real time. To set up an appointment, contact Lauren Macready at marketing(at)coolitsystems(dot)com.

About CoolIT Systems
CoolIT Systems, Inc. is the world leader in energy efficient Direct Contact Liquid Cooling for the Data Center, Server and Desktop markets. CoolIT’s Rack DCLC™ platform is a modular, rack-based, advanced cooling solution that allows for dramatic increases in rack densities, component performance, and power efficiencies. The technology can be deployed with any server and in any rack making it a truly flexible solution. For more information about CoolIT Systems and its technology, email or visit

About ISC High Performance
ISC High Performance, formerly known as ISC (the International Supercomputing Conference), is the world’s oldest and Europe’s foremost HPC conference. Its history dates back 30 years, when in 1986 the late Hans Werner Meuer, in his capacity as the director of the Mannheim Computing Center and professor for computer science, organized the world’s first “Supercomputer Seminar” at Mannheim University. In its inaugural year, it drew 81 attendees, mostly German-speaking. Today it is valued by over 2,600 international attendees as a “must attend” HPC event. For more information visit

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