Adhering to the New Standard, Vantec has Tested the SuperSpeed USB 3.0
Lineup with GIGABYTE Motherboards
FREMONT, California – June 18, 2010 – Vantec Thermal Technologies, a worldwide leader specializing in computer accessories and GIGABYTE Technology Co. Ltd., the leader in USB 3.0 motherboards,
announces the success of the joint product testing of SuperSpeed USB 3.0 products. SuperSpeed USB 3.0 is still in the early stages of development and as more products become readily available to the
market, testing from host and device side manufacturers is necessary to ensure the stability and compatibility of products.
Currently, GIGABYTE has tested the full line-up of USB 3.0 products from Vantec. Ranging from the NexStar 3 SuperSpeed, NexStar CX SuperSpeed, to the NexStar Hard Drive Dock, all passed with flying
colors. “We will continue to test and make sure all of our USB 3.0 products are compatible with the myriad of motherboards available on the market,” said Jonathan Yu, Product Manager at Vantec.
“We’re excited to see Vantec’s line of USB 3.0 storage devices come to market after the huge interest in USB 3.0 products that we saw at Computex,” said Tim Handley, Deputy Director of Motherboard
Marketing at GIGABYTE Technology Co. Ltd. “The Compatible with GIGABYTE USB 3.0 Motherboards certification assures our customers that Vantec’s USB 3.0 devices work well with the 35 plus USB 3.0models that we currently offer.”SuperSpeed USB 3.0 is the next generation bus interface offering transfer speeds of up to 5Gbps (625Mbps) and is fully backwards-compatible with USB 2.0 and USB 1.1. With the advent introduction of the SuperSpeed USB 3.0 interface, Vantec has continued to update their product line with the latest
technology and provide products suitable for the mass market.Various models of SuperSpeed USB 3.0 products are readily available on the market. For additional product information and full technical specifications, please visit www.vantecusa.com. For GIGABYTE product information, please visit www.gigabyte.com.